IEEE Electronic Packaging Award

5th March 2018- IEEE Electronic Packaging Society has awarded IEEE Electronic Packaging Award to Mr. Soo Kuan Lim from Materials Engineering, Universiti Sains Malaysia (USM). He was chosen based on his excellent performance in Final Year Project related to electronic applications. The award ceremony was held in School of Materials and Mineral Resources Engineering, USM.ieee

 Poster virtual run 001 edited for web

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